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  1. 61.
    Scaling Open-Source HW Accelerator for Deep NN Inference (UDE, Fraunhofer IMS)
    semiengineering.com · /feed
    ▲ 0 · Jun 2
  2. 62.
    Moving Intelligence Closer to the Sensor Edge (IBM Research)
    semiengineering.com · /feed
    ▲ 0 · Jun 2
  3. 63.
    Flexible AI-MCU For Fast Inference of Transformer Models At The Ultra-Low-Power Edge (ETH Zurich, U. Bologna)
    semiengineering.com · /feed
    ▲ 0 · Jun 2
  4. 64.
    The Evolution Of UCIe
    semiengineering.com · /feed
    ▲ 0 · Jun 2
  5. 65.
    Chip Industry Technical Paper Roundup: Jun. 2
    semiengineering.com · /feed
    ▲ 0 · Jun 2
  6. 66.
    Research Bits: Jun. 2
    semiengineering.com · /feed
    ▲ 0 · Jun 2
  7. 67.
    The Sub-2nm Paradox
    semiengineering.com · /feed
    ▲ 0 · Jun 1
  8. 68.
    Building Fixed HW Implementations of Neural Networks (Yale, Cornell et al.)
    semiengineering.com · /feed
    ▲ 0 · May 29
  9. 69.
    Moving Defect Detection And Classification To The Edge
    semiengineering.com · /feed
    ▲ 0 · May 29
  10. 70.
    Chip Industry Week In Review
    semiengineering.com · /feed
    ▲ 0 · May 29
  11. 71.
    From Billions Of Violations To Actionable Insights: Calibre Vision AI
    semiengineering.com · /feed
    ▲ 0 · May 29
  12. 72.
    Swapping Out Chiplets: I/Os Vs. Compute
    semiengineering.com · /feed
    ▲ 0 · May 28
  13. 73.
    Toward Agentic Verification
    semiengineering.com · /feed
    ▲ 0 · May 28
  14. 74.
    Observability Is Essential For Modern Silicon
    semiengineering.com · /feed
    ▲ 0 · May 28
  15. 75.
    Why Your NoC Verification Strategy Must Consider Using Formal
    semiengineering.com · /feed
    ▲ 0 · May 28
  16. 76.
    Automating Traditional PCB Layout Verification With Electrically Based Design Rule Checks
    semiengineering.com · /feed
    ▲ 0 · May 28
  17. 77.
    Using SystemC TLM Modeling To Solve AI Data Movement Challenges
    semiengineering.com · /feed
    ▲ 0 · May 28
  18. 78.
    Foundation Model For Physics: The Next Layer Of Intelligence For Engineering
    semiengineering.com · /feed
    ▲ 0 · May 28
  19. 79.
    Faster Verification Debug With AI
    semiengineering.com · /feed
    ▲ 0 · May 28
  20. 80.
    Wafer-Scale vs. Chiplets: The New War? Part 1
    semiengineering.com · /feed
    ▲ 0 · May 28
  21. 81.
    The Shape Of Prompts: Exploring Their Effect On Inference Infrastructure
    semiengineering.com · /feed
    ▲ 0 · May 28
  22. 82.
    A Scalable Answer To Advanced-Node Characterization
    semiengineering.com · /feed
    ▲ 0 · May 28
  23. 83.
    Overcoming Bottlenecks In Data Movement
    semiengineering.com · /feed
    ▲ 0 · May 27
  24. 84.
    Curvilinear Masks Push The Limits Of Inspection And Metrology
    semiengineering.com · /feed
    ▲ 0 · May 27
  25. 85.
    Deterministic, Solver-Accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages
    semiengineering.com · /feed
    ▲ 0 · May 27
  26. 86.
    Rethinking AI-Scale Data Center Validation
    semiengineering.com · /feed
    ▲ 0 · May 27
  27. 87.
    Blog Review: May 27
    semiengineering.com · /feed
    ▲ 0 · May 27
  28. 88.
    Multiphysics Fusion Technology for Multi-Die Designs Explained
    semiengineering.com · /feed
    ▲ 0 · May 27
  29. 89.
    Characterization of GPU-based Inference for Reasoning-Centric LLMs (Micron, Argonne)
    semiengineering.com · /feed
    ▲ 0 · May 26
  30. 90.
    Chip Industry Technical Paper Roundup: May 26
    semiengineering.com · /feed
    ▲ 0 · May 26